bga reballing stencil template


BGA Reballing Stencil Template for CXD2996GB CXD2996AGB CXD2996BGB CXD2996CGB CXD2996

BGA Reballing Stencil Template for CXD2996GB CXD2996AGB CXD2996BGB CXD2996CGB CXD2996

BGA Reballing Stencil Template for CXD2996GB CXD2996AGB CXD2996BGB CXD2996CGB CXD2996

This stencil is fit for CXD2996GB CXD2996AGB CXD2996BGB CXD2996CGB CXD2996.

Dear Buyers,
Please pay attention to the following instruction upon receipt our chips
The BGA chips you buy from our company are of high technology and as precise as nanometer.
For small quantity of chips, they are exposed to the air after being taken out from package. So they probably will adhere to some humidity. Thus, in order to avoid quality problem, we suggest that you put them inside a baking chamber for at least 24 hours at 100℃-110℃。
When soldering, please control the temprature precisely.
Lead-Free/No Pb BGA chips is 245℃--260℃ (Maximum)
Leaded/Pb BGA chips 180℃--205℃ (Maximum).
The soldering process is complicated. Soldering/replacing chips must be operated by engineers who have proficient skills.
As BGA chips are fragile, complicatedly structured, with numerous balls, any slightly faulty positioning, careless temperature-control, or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering. The chips will, as a result, die.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1) Have you bought the right chips?
2) Do you have proper equipment?
3) Are you skillful enough to solder the chips?

If you have any question about the product, or any other information, please be free to contact us.


BGA Reballing Stencil Template For Qualcomm PM Power ic PM8917 PMI8937 PM8937 PM7150 PM6125 PM8150 PM8952 PMI8952 PM8998 PM660

BGA Reballing Stencil Template For Qualcomm PM Power ic PM8917 PMI8937 PM8937 PM7150 PM6125 PM8150 PM8952 PMI8952 PM8998 PM660

Amaoe IPDY1 BGA Reballing Stencil Template For iPhone 11 12 13 Pro Max Mini 11Pro 12Pro 13Pro Max LCD screen IC repair tools

Amaoe IPDY1 BGA Reballing Stencil Template For iPhone 11 12 13 Pro Max Mini 11Pro 12Pro 13Pro Max LCD screen IC repair tools

Welcome to our store


We specialize in integrated circuit chips


If you need to purchase more models


Click on the“Add To Cart”

• Shipping Information


Items will be ship within3 daysof payment receive.


working days(2-4 weeks)to receive for most area.


If you do not receive item within 30 working days(5 weeks), please contact us to investigate the case.



The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.


As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning


careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.


BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:


1) Have you bought the right chips?


2) Do you have proper equipment?


3) Are you skillful enough to solder the chips?


90MM Silver BGA Reballing Station Stencils Template Holder Foxture Jig Rework For PCB Chip Soldering Repair

90MM Silver BGA Reballing Station Stencils Template Holder Foxture Jig Rework For PCB Chip Soldering Repair

90MM Silver BGA Reballing Station Stencils Template Holder Foxture Jig For PCB Chip Soldering Rework Repair 

 
Feature
Brand new
High quality
It is easy to work with
 
Note: This jig does not support PS3 GPU chip
 
 
Specification 
Material: Metal
Dimensions: 9 x 8 x 3 cm
Net weight: 394 g
 
Package Included 
1 x BGA Reballing Station
1 x Allen key
 
reballing station (1) reballing station (2) reballing station (3) reballing station (4) reballing station (5)
 
 
 

8pcs Directly Heat BGA Reballing Stencil Template for Memory RAM DDR1 DDR2 DDR3 DDR5

8pcs Directly Heat BGA Reballing Stencil Template for Memory RAM DDR1 DDR2 DDR3 DDR5

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4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template


Description:

brand new and high quality.

Feature:

These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.

Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.

High success rate of planting tin, the solder balls can be formed once when you are proficient.

Simple and convenient to use.

BGA Reballing Stencil only, other accessories demo in the picture is not included!

 

Specifications:

Item Type: BGA Reballing Stencil

Material: Stainless Steel

Size: Standard Size

Color: Silver

Quantity: 4PCS

 

Note:

No retail package.

Transition: 1cm=10mm=0.39inch

Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.

Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

 

Package Includes:

4 x BGA Reballing Stencils












Memory Direct Heat BGA Reballing Stencils Template Holder Jig For DDR1 DDR2 DDR3 DDR5 DR2-3 DDR3-2 GDDR5 Welding Rework Repair

Memory Direct Heat BGA Reballing Stencils Template Holder Jig For DDR1 DDR2 DDR3 DDR5 DR2-3 DDR3-2 GDDR5 Welding Rework Repair

Qianli Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit for iPhone X XS XSMAX 11 13 Pro Max Repair

Qianli Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit for iPhone X XS XSMAX 11 13 Pro Max Repair

Qianli Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit for iPhone X XS XSMAX 11 13 Pro Max Repair


--BGA Reballing Platform for iPhone X-13.
--High temperature magnetic strong pressing, Prevent the stencils from bulging caused by high temperatue.
--Square chamfer mesh, prevent the tin balls from being stuck in the mesh.

Package :
1 * BGA Reballing Stencil Kit



IRepair P10 DFU BOX IBox Non-Removal Programmer for Iphone Ipxd Development Firmware Mode SN Read Write One-Click Unpack WiFiUSD 73.85/piece
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NB-Pro 4 in1Socket for ICFRIEND E-mate EMMC& UFS BGA254 BGA297 Support Easy-jtag box Medusa box riffv2 NB-Pro Socket for ICFRIENUSD 205.92/piece

XINZHIZAO X360 BGA Reballing Preheating Platform For iPhone X-12PROMAX Motherboard Layered/IC Chip BGA Stencil/Dot Matrix Repair

XINZHIZAO X360 BGA Reballing Preheating Platform For iPhone X-12PROMAX Motherboard Layered/IC Chip BGA Stencil/Dot Matrix Repair

Note: This have 110V and 220V , if u place order , plz note in u order , which u need , thank u

XINZHIZAO X360 BGA Reballing Preheating Platform For iPhone X-12PROMAX Motherboard Layered/IC Chip BGA Stencil/Dot Matrix Repair

Amaoe SSD1 BGA Reballing Stencil Template For For Switch IC BGA200 NFCBEA BCM4354 MAX77620A MAX77812 CYW20734 T=0.12MM

Amaoe SSD1 BGA Reballing Stencil Template For For Switch IC BGA200 NFCBEA BCM4354 MAX77620A MAX77812 CYW20734 T=0.12MM

Welcome to our store


We specialize in integrated circuit chips


If you need to purchase more models


Click on the“Add To Cart”

• Shipping Information


Items will be ship within3 daysof payment receive.


working days(2-4 weeks)to receive for most area.


If you do not receive item within 30 working days(5 weeks), please contact us to investigate the case.



The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.


As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning


careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.


BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:


1) Have you bought the right chips?


2) Do you have proper equipment?


3) Are you skillful enough to solder the chips?



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